Wire sawing is a method for slicing and cutting silicon wafers. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the silicon wafer production.
CUMISLICE – Premium micro grit for slicing silicon wafers is classified to narrow customized size distributions, offers the benefits of predictable performance in wafer slicing.
This product is critically designed and tailored to yield:
- Desired wafer thickness
- Close TTV distribution
- Superior surface quality
- Low kerf loss